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rohs 2002/95/ec e 3 pb ds-ix2127 - r02 www.clare.com 1 driver characteristics features ? floating channel designed fo r bootstrap operation up to 600v ? tolerant to negative transient voltages; dv/dt immune ? undervoltage lockout ? 3.3v, 5v, and 12v input logic compatible ? open-drain fault indicator pin shows over-current shutdown ? output in phase with the input applications ? high-speed gate driver ? motor drive inverter description the ix2127 is a high-voltage, high-speed power mosfet and igbt driver. high-voltage level-shift circuitry enables this device to operate up to 600v. clare?s proprietary common-mode design techniques provide stable operation in high dv/dt noise environments. an on-board comparator can be used to detect an over-current condition in the driven mosfet or igbt device, and then shut down drive to that device. an open-drain output, fault , indicates that an over-current shutdown has occurred. the gate driver output typically can source 250ma and sink 500ma, which is suitable for fluorescent lamp ballast, motor control, smps, and other converter drive topologies. the ix2127 is provided in 8-pin dip and 8-pin soic packages, and is available in tape & reel versions. see ordering information below. ordering information ix2127 block diagram parameter rating units v offset 600 v i o +/- (source/sink) 250/500 ma v csth 250 mv t on / t off (typical) 100 ns part description ix2127g 8-pin dip (50/tube) ix2127n 8-pin soic (100/tube) ix2127ntr 8-pin soic (2000/reel) v cc in fault com v b ho v s cs buffer comparator delay undervoltage lockout data latch transmitter high-low level shift low-high level shift receiver transmitter data latch receiver low side high side qr s enable enable blanking signal + _ v cc ix2127 high-voltage power mosfet & igbt driver
ix2127 2 www.clare.com r02 1. specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.1 package pino u t . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.2 pin description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.3 a b sol u te maxim u m ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.4 recommended operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 1.5 general conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 1.6 electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 1.7 timing characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2. performance data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 3. manufacturing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 3.1 moist u re sensiti v ity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 3.2 esd sensiti v ity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 3.3 reflo w profile. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 3.4 board wash . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 3.5 mechanical dimensions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
ix2127 r02 www.clare.com 3 1 specifications 1.1 package pinout 1.2 pin description 1.3 absolute maximum ratings unless otherwise specified, ratings are provided at t a =25c and all bias levels are with respect to com. absolute maximum electrical ratings are at 25c absolute maximum ratings are stress ratings. stresses in excess of these ratings can cause permanent damage to the device. functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. 1 2 3 4 5 6 7 8 v cc in com fault v b ho v s cs pin# name description 1 v cc logic supply voltage 2in logic input 3fault fault indicator output 4com logic ground 5 v s high side return 6cs comparator input, over-current detect 7ho high side gate drive output 8 v b high side supply voltage parameter symbol minimum maximum units logic s u pply voltage v cc -0.3 15 v high side floating s u pply voltage v b -0.3 625 high side floating offset voltage v s v b -12 v b +0.3 logic inp u t voltage v in -0.3 v cc +0.3 high side floating o u tp u t voltage v ho v s -0.3 v b +0.3 c u rrent sense voltage v cs v s -0.3 v b +0.3 fault o u tp u t voltage v flt -0.3 v cc +0.3 allo w a b le offset s u pply voltage transient dv s /dt -50v/ns package po w er dissipation 8-lead dip p d -1 w 8-lead soic - 0.625 j u nction temperat u re t j -150 c storage temperat u re t s -55 150
ix2127 4 www.clare.com r02 1.4 recommended operating conditions 1.5 general conditions typical values are characteristic of the device at 25c and are the result of engineering evaluations. they are provided for information purposes only and are not part of the manufacturing testing requirements. unless otherwise noted, all electrical specifications are listed for t a =25c. 1.6 electrical characteristics unless otherwise specified, the test conditions are: v cc =v bs =12v; v cc , in, fault , and leakage voltages and currents are referenced to com; v b , ho, and cs voltages and currents are referenced to v s . 1.6.1 po w er s u pply specifications 1.6.2 gate dri v e and sh u tdo w n specifications * r gate value must be 20 ? or greater. parameter symbol minimum maximum units logic s u pply v cc 912 v high side floating s u pply v b v s +9 v s +12 high side offset voltage v s -5 600 logic inp u t voltage v in 0 v cc high side floating o u tp u t v ho v s v b c u rrent sense signal voltage v cs v s v s +5 fault o u tp u t voltage v flt 0 v cc am b ient temperat u re t a -40 +125 c parameter conditions symbol minimum typical maximum units q u iescent v cc s u pply c u rrent v in =0v i qcc -280400 ? a q u iescent v bs s u pply c u rrent v in =0v i qbs - 500 1000 v bs uvlo positi v e-going threshold - v bs_uv+ 6.8 7.7 8.6 v v bs uvlo negati v e-going threshold - v bs_uv- 6.3 7.2 8.1 offset s u pply leakage c u rrent v b =v s =600v i lkg --2 ? a parameter conditions symbol minimum typical maximum units high le v el o u tp u t voltage, v b -v ho i ho =0a v oh --100 mv lo w le v el o u tp u t voltage, v ho i ho =0a v ol --100 o u tp u t short circ u it p u lsed c u rrent v ho =0v, v in =5v, pw< 10 ? s, r gate =20 ? * (see fig u re 1) i ho+ -200 -250 - ma v ho =12v, v in =0v, pw< 10 ? s, r gate =20 ? * (see fig u re 1) i ho- 420 500 - cs inp u t, positi v e-going threshold v cc =9v to 12v v cs_th+ 180 260 320 mv ?high? cs bias c u rrent v cs =3v i cs+ --1 ? a v cs =0v i cs- ---1
ix2127 r02 www.clare.com 5 1.6.3 logic i/o specifications 1.6.4 thermal specifications 1.7 timing characteristics figure 1. typical connection diagram parameter conditions symbol minimum typical maximum units logic ?1? inp u t voltage v cc =9v to 12v v ih 3.0 - - v logic ?0? inp u t voltage v cc =9v to 12v v il --0.8 logic ?1? inp u t bias c u rrent v in =5v i in+ -2.615 ? a logic ?0? inp u t bias c u rrent v in =0v i in- ---1 fault on-resistance - flt, r on -72- ? parameter conditions symbol minimum typical maximum units thermal resistance, j u nction to am b ient: 8-lead dip - r ? ja --125 c/w 8-lead soic --200 parameter conditions symbol minimum typical maximum units t u rn-on propagation delay v cc =v bs =12v, c l =1nf, t a =25c t on -100200 ns t u rn-off propagation delay t off -73200 t u rn-on rise time t r -23130 t u rn-off fall time t f -2065 start-up blanking delay t blk 550 766 950 cs sh u tdo w n propagation delay t cs -220360 cs to flt propagation delay t flt -236510 1 2 3 4 5 6 7 8 fault fault v cc v cc in in com v b ho cs v s r gate
ix2127 6 www.clare.com r02 1.7.1 i/o timing diagram 1.7.2 s w itching time wa v eforms 1.7.3 start u p blanking time wa v eforms 1.7.4 cs sh u tdo w n wa v eforms 1.7.5 cs to flt wa v eforms i n cs fault ho 50% 90% 10% t on t r t off t f i n ho 50% 90% i n cs t b lk ho fault 90% cs ho v cs_th+ t cs 90% cs fault v cs_th+ t flt
ix2127 r02 www.clare.com 7 2 performance data v cc supply volta g e (v) 9.0 9.5 10.0 10.5 11.0 11.5 12.0 i qcc ( a) 0 50 100 150 200 250 quiescent v cc supply current i qcc vs. volta g e v bs supply volta g e (v) 9.0 9.5 10.0 10.5 11.0 11.5 12.0 i qbs ( a) 0 100 200 300 400 500 quiescent v bs supply current i qbs vs. volta g e temperature (oc) -50 -25 0 25 50 75 100 125 threshold uvlo+ (v) 0 2 4 6 8 10 vbs undervolta g e lockout positive-goin g threshold uvlo+ vs. temperature temperature (oc) -50 -25 0 25 50 75 100 125 i qcc ( a) 0 50 100 150 200 250 300 quiescent v cc supply current i qcc vs. temperature temperature (oc) -50 -25 0 25 50 75 100 125 i qbs ( a) 0 100 200 300 400 500 quiescent v bs supply current i qbs vs. temperature temperature (oc) -50 -25 0 25 50 75 100 125 threshold uvlo- (v) vbs undervolta g e lockout ne g ative-goin g threshold uvlo- vs. temperature 0 2 4 6 8 10 v cc supply (v) input volta g e (v) lo g ic "1" input threshold volta g e vs. v cc 9.0 9.5 10.0 10.5 11.0 11.5 12.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 v cc supply volta g e (v) 9.0 9.5 10.0 10.5 11.0 11.5 12.0 input volta g e (v) lo g ic "0" input threshold volta g e vs. v cc 0.0 0.5 1.5 2.5 3.0 2.0 1.0 v cc supply volta g e (v) 9.0 9.5 10.0 10.5 11.0 11.5 12.0 threshold (mv) cs input positive goin g threshold vs. v cc 0 50 100 150 200 250 300 350 temperature (oc) -50 -25 0 25 50 75 100 125 input volta g e (v) 0.0 0.5 1.0 1.5 2.0 2.5 3.0 lo g ic "1" input threshold volta g e vs. temperature (v cc =12v) temperature (oc) -50 -25 0 25 50 75 100 125 input volta g e (v) 0.0 0.5 1.0 1.5 2.0 2.5 3.0 lo g ic "0" input threshold volta g e vs. temperature (v cc =12v) temperature (oc) -50 -25 0 25 50 75 100 125 threshold (mv) 0 50 100 150 200 250 300 350 cs input positive goin g threshold vs. temperature (v cc =12v)
ix2127 8 www.clare.com r02 volta g e (v) 9.0 9.5 10.0 10.5 11.0 11.5 12.0 input current ( a) 0 1 2 3 4 5 lo g ic "1" input current i in + vs. volta g e v bias supply volta g e (v) 9.0 9.5 10.0 10.5 11.0 11.5 12.0 turn-on delay time (ns) turn-on time vs. supply volta g e 0 25 50 75 100 125 150 175 200 supply volta g e (v) 9.0 9.5 10.0 10.5 11.0 11.5 12.0 rise time (ns) 0 25 50 75 100 125 150 175 200 turn-on rise time vs. supply volta g e temperature (oc) -50 -25 0 25 50 75 100 125 input current ( a) 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 lo g ic "1" input current i in + vs. temperature temperature (oc) -50 -25 0 25 50 75 100 125 turn-on time (ns) 0 25 50 75 100 125 150 175 200 turn-on time vs. temperature (v cc =v bs =12v) temperature (oc) -50 -25 0 25 50 75 100 125 rise time (ns) 0 50 100 150 200 turn-on rise time vs. temperature (v cc =v bs =12v) volta g e (v) 9.0 9.5 10.0 10.5 11.0 11.5 12.0 input current ( a) -1.0 -0.5 0.0 0.5 1.0 lo g ic "0" input current i in - vs. volta g e v bias supply volta g e (v) 9.0 9.5 10.0 10.5 11.0 11.5 12.0 turn-off delay time (ns) turn-off time vs. supply volta g e 0 25 50 75 100 125 150 175 200 supply volta g e (v) 9.0 9.5 10.0 10.5 11.0 11.5 12.0 turn-off fall time (ns) 0 5 10 15 20 25 turn-off fall time vs. supply volta g e temperature (oc) -50 -25 0 25 50 75 100 125 input current ( a) -1.0 -0.5 0.0 0.5 1.0 lo g ic "0" input current i in - vs. temperature temperature (oc) -50 -25 0 25 50 75 100 125 turn-off delay time (ns) 0 25 50 75 100 125 150 175 200 turn-off time vs. temperature (v cc =v bs =12v) temperature (oc) -50 -25 0 25 50 75 100 125 turn-off fall time (ns) 0 10 20 30 40 50 turn-off fall time vs. temperature (v cc =v bs =12v)
ix2127 r02 www.clare.com 9 temperature (oc) -50 -25 0 25 50 75 100 125 output volta g e (mv) -10 0 10 20 30 40 50 60 70 8 0 90 100 hi g h-level output volta g e v oh (v b -v ho ) vs. temperature v bias volta g e (v) 10.0 10.5 11.0 11.5 12.0 output source current (ma) output source current vs. volta g e (v cc =v bs =v bias , v in =5v, pw 10 s) 0 50 100 150 200 250 300 ref. fi g . 1: r gate =20 v bias volta g e (v) 10.0 10.5 11.0 11.5 12.0 output sink current (ma) output sink current vs. v bias volta g e (v cc =v bs =v bias , v in =0v, pw 10 s) 0 100 200 300 400 500 600 ref. fi g . 1: r gate =20 temperature (oc) -50 -25 0 25 50 75 100 125 output volta g e (mv) -10 0 10 20 30 40 50 60 70 8 0 90 100 low-level output volta g e v ol vs. temperature temperature (oc) -50 -25 0 25 50 75 100 125 output source current (ma) 0 50 100 150 200 250 300 350 output source current vs. temperature (v cc =v bs =12v, v in =5v, pw 10 s) ref. fi g . 1: r gate =20 temperature (oc) -50 -25 0 25 50 75 100 125 output sink current (ma) output sink current vs. temperature (v cc =v bs =12v, v in =0v, pw 10 s) ref. fi g . 1: r gate =20 0 100 200 300 400 500 600 input volta g e (v) 9.0 9.5 10.0 10.5 11.0 11.5 12.0 delay (ns) start-up blankin g delay vs. input volta g e 0 100 200 300 400 500 600 700 input volta g e (v) 9.0 9.5 10.0 10.5 11.0 11.5 12.0 delay (ns) cs shutdown propa g ation delay vs. input volta g e 0 50 100 150 200 250 v cc supply volta g e (v) 9.0 9.5 10.0 10.5 11.0 11.5 12.0 delay (ns) cs to flt propa g ation delay vs. v cc supply volta g e 0 50 100 150 200 250 300 350 temperature (oc) -50 -25 0 25 50 75 100 125 delay (ns) 0 100 200 300 400 500 600 700 8 00 start-up blankin g delay vs. temperature (v cc =v bs =12v) temperature (oc) -50 -25 0 25 50 75 100 125 delay (ns) 0 50 100 150 200 250 300 cs shutdown propo g ation delay vs. temperature temperature (oc) -50 -25 0 25 50 75 100 125 delay (ns) 0 50 100 150 200 250 300 350 cs to flt propa g ation delay vs. temperature (v cc =v bs =12v)
ix2127 10 www.clare.com r02 3 manufacturing information 3.1 moisture sensitivity all plastic encapsulated se miconductor packages are susceptible to moisture ingression. clare classified all of its plastic encapsulated device s for moisture sensitivity according to the latest version of the joint industry standard, ipc/jedec j-std-020 , in force at the time of product evaluation. we test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and informat ion in that standard as well as to any limitations set forth in the information or standards referenced below. failure to adhere to the warnings or limitations as establ ished by the listed specificati ons could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. this product carries a moisture sensitivity level (msl) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard ipc/jedec j-std-033 . 3.2 esd sensitivity this product is esd sensitive , and should be handled according to the industry standard jesd-625 . 3.3 reflow profile this product has a maximum body temperature and time rating as shown below. all other guidelines of j-std-020 must be observed. 3.4 board wash clare recommends the use of no-clean flux formulations. however, board washing to remove flux residue is acceptable, and the use of a short drying bake may be necessary. chlorine-based or fluorine-based solvents or fluxes should not be used. cleaning methods th at employ ultrasonic energy should not be used. device moisture sensitivity level (msl) rating ix2127g / ix2127n msl 1 device maximum temperature x time ix2127g 250c for 30 seconds ix2127n 260c for 30 seconds rohs 2002/95/ec e 3 pb
ix2127 r02 www.clare.com 11 3.5 mechanical dimensions 3.5.1 8-pin dip thro u gh-hole package 3.5.2 8-pin soic package dimensions mm (inches) pcb hole pattern 2.540 0.127 (0.100 0.005) 6.350 0.127 (0.250 0.005) 9.144 0.50 8 (0.360 0.020) 0.457 0.076 (0.01 8 0.003) 9.652 0.3 8 1 (0.3 8 0 0.015) 7.239 typ. (0.2 8 5) 7.620 0.254 (0.300 0.010) 4.064 typ (0.160) 0. 88 9 0.102 (0.035 0.004) 8 -0. 8 00 dia. ( 8 -0.031 dia.) 2.540 0.127 (0.100 0.005) 7.620 0.127 (0.300 0.005) 7.620 0.127 (0.300 0.005) 6.350 0.127 (0.250 0.005) 3.302 0.051 (0.130 0.002) 0.254 typ (0.01) dimensions mm mi n / mm max (inches mi n / inches max) 5. 8 014 / 6.1976 (0.22 8 4 / 0.2440) 0.356 / 0.457 (0.014 / 0.01 8 ) 1.27 typ (0.05 typ) 3. 8 10 / 3.9 88 (0.150 / 0.157) 4. 8 01 / 4.97 8 (0.1 8 9 / 0.196) 0.533 ref (0.021 ref) 1.524 / 1.727 (0.060 / 0.06 8 ) 0.1016 / 0.24 8 9 (0.0040 / 0.009 8 ) 0.406 / 1.270 (0.016 / 0.050) 0.1905 / 0.24 8 9 (0.0075 / 0.009 8 ) 1.372 / 1.575 (0.054 / 0.062) pcb land pattern 1.27 (0.050) 0.60 (0.024) 1.50 (0.059) 5.30 (0.209)
ix2127 12 www.clare.com r02 3.5.3 tape & reel packaging for 8-pin soic package dimensions mm (inches) note: tape dimensions not sho w n comply w ith jedec standard eia-4 8 1-2 em b ossment em b ossed carrier to p c o v er tape thickness 0.102 max. (0.004 max.) 330.2 dia. (13.00 dia.) k 0 = 2.10 (0.0 8 3) w =12.00 (0.472) b 0 =5.30 (0.209) user direction of feed a 0 =6.50 (0.256) p= 8 .00 (0.315) for additional information please visit our website at: www.clare.com clare, inc. makes no representations or warranties with respect to the accuracy or completeness of the contents of this publica tion and reserves the right to make changes to specifications and product descriptions at any time without notice. neither circuit patent licenses nor indemnity are expressed or implied. except as set forth in clare?s standard terms and conditions of sale, clare, inc. assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. the products described in this document are not designed, intended, authorized or warranted for use as components in systems in tended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of clare?s product may result in direct physical harm, i njury, or death to a person or severe property or environmental damage. clare, inc. reserves the right to discontinue or ma ke changes to its products at any time without notice. specification: ds-ix2127-r02 ?copyright 2011, clare, inc. all rights reserved. printed in usa. 8/8/2011

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